Cindy Chen
Contact Person
Minimum Quantity: 1 pieces
FOB Price: $1
Eelectroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap), Oxide Wafers (LiTaO3), Optical Glass.
Details
Electroformed hub dicing blade is made by using an ultra-thin diamond wheel and a high precision aluminum alloy hub.
Applications Of Hub Dicing Blade
Cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap), Oxide Wafers (LiTaO3), Optical Glass
The Features Of Hub Type Dicing Blade
* Improving balance between blade life and processing quality (in particular backside chipping)
* Strengthens rigidity, Reduction in wavy cutting and blade wear under high load conditions
* Precise control of diamond grit size, diamond concentration, and nickel bond hardness to reduce splitting on the edges
* Realizes high speed wafer cutting after laser grooving
No review are found
