Resin bond Diamond Dicing Blade Product Detail

Zoe Chen

More SuperHard Products Co., Ltd

100 Items

Resin bond Diamond Dicing Blade

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Minimum Quantity: 1 pieces

FOB Price: $1

Resin dicing blade is suited for cutting hard and brittle materials,such as QFN, sapphire, quartz and glass, etc
Alias: 1A8 Dicing Blade, Resin bond Blade
Cutting glass, quartz, QFN, sapphire
E-mail: zoe@moresuperhard.com

* Excellent cutting ability that help reduce chipping, fractures and achive smooth surface finish

* Dicing hard and brittle materials. Such as QFN/MLF, Thick Ceramic Substrates and Glass, etc

* Able to precisely control diamond concentration to achieve cutting quality

* Self sharpening matrix to expose new diamonds. Diamond grit size ranges from 3?m to 250?m depending on blade thickness
Applications of resin bond dicing blade

Glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN ?copper epoxy molding ), splitter, sapphire