Zoe Chen
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Minimum Quantity: 1 pieces
FOB Price: $1
Eelectroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass Alias: hub dicing blade, dicing blade Application: silicon wafer, copper wafer E-mail: zoe@moresuperhard.com Electroformed hub dicing blade is made by using an ultra-thin diamond wheel and a high precision aluminum alloy hub. Applications of hub dicing blade Cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass The features of hub type dicing blade * Improving balance between blade life and processing quality (in particular backside chipping) * Strengthens rigidity, Reduction in wavy cutting and blade wear under high load conditions * Precise control of diamond grit size, diamond concentration, and nickel bond hardness to reduce splitting on the edges * Realizes high speed wafer cutting after laser grooving
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Product detail
Product Name: Electroformed hub dicing blade
Product id:
Unit Price: $1 USD
Unit: 1
Min. Quantity: 1
Diamond Penc
Price $1
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Silicon grin
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