Zoe Chen
Contact Person
Minimum Quantity: 1 pieces
FOB Price: $1
Eelectroformed hub dicing blade is used for cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass
Alias: hub dicing blade, dicing blade
Application: silicon wafer, copper wafer
E-mail: zoe@moresuperhard.com
Electroformed hub dicing blade is made by using an ultra-thin diamond wheel and a high precision aluminum alloy hub.
Applications of hub dicing blade
Cutting Silicon Wafers, copper wafer, IC/LED Packages, Compound Semiconductor Wafers (GaAs, Gap),Oxide Wafers (LiTaO3), Optical Glass
The features of hub type dicing blade
* Improving balance between blade life and processing quality (in particular backside chipping)
* Strengthens rigidity, Reduction in wavy cutting and blade wear under high load conditions
* Precise control of diamond grit size, diamond concentration, and nickel bond hardness to reduce splitting on the edges
* Realizes high speed wafer cutting after laser grooving
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