Caroline Huang(caroline@hmxpcb.com)
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layer count?20L base material? FR-4 TG170 copper thickness? all layers 2OZ board thickness? 3.2mm±0.3mm min hole diameter? 0.50mm(19mil) min trace width? 0.20mm(8mil) min trace spacing? 0.20mm(8mil) suface finishing? ENIG test? flying probe panel dimension? 106.63mmX134.42 mm panel method? 6up, 2*3 blind?dr1-2?dr3-4, 2 step blind vias via diameter: 0.5mm(19mil) lead time?fastest 10wds?normal 15-20 wds
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Product Name: 20L blind/buried vias
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4L,black sol
Price $0
FR4,white so
FR4,black co
Single Layer
HF High Freq