Shenzhen Hemeixin Electronics

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4L,black soldermask,ITEQ

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layers count?4L
base mateial? ITEQ TG180
board thickness? 1.60±0.15mm
min hole? 0.20mm(8mil)
min trace width? 0.089mm(3.5mil)
min trace spacing? 0.094mm(3.7mil)
surface finishing? ENIG
test? flying p... more>>

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FR4,white soldermask

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Base Material? FR-4
Layers Count: ? 1
Copper Thickness:? 1/0 OZ (35/0 um)
Board Thickness: 1.60±0.15mm
Min Hole Diameter: 0.61mm(24mil)
Min Trace Width: 0.38mm(15mil)
Min Trace Spacing: 0.24mm(9mil... more>>

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FR4,black color base material,thin

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Material: FR-4, black color material
Layers Count: 1
Copper Thickness: 2/0 oz(70/0 um)
Board Thickness: 0.30mm
Flammability Rating: 94V-0
Peelable Strength: 10.4N/cm
Warp-twit: ? 1.5%
Isolated Resist... more>>

Packaging & Delivery

Single Layer Board

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Layers Count: 1
Copper thickness: 2/0 oz((70/0 um)
Board Thickness: 1.6mm
Peelable Strength: 10.4N/cm
Warp-twit: ? 1.5%
Isolated Resistance: ? 10 ?
Test Voltage: 50-100DCV
Min Trace w/s: 0.20/0.20mm... more>>

Packaging & Delivery

Single Layer Board

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Material? FR-4
Copper Thickness? 1/0 OZ (35/0 um)
Board Thickness? 1.60±0.15mm
Surface Finishing? ENIG
Panel Method? 10up, 2*5
Lead Time?fastest 12h?normal 3-5wds

Packaging & Delivery

HF High Frequency Board

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Lyers count?2L
base mateial? HF Base Material
board thickness? 4.00±0.20mm
min hole? 0.50mm(19mil)
surface finishing? ENIG
test? flying probepanel
dimension? 90.00mmX90.00mm/pcs
panel method? 1up,... more>>

Packaging & Delivery

2L, 5oz introduction cooke board

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Number of layers: 2-layer
Copper Thickness: 5/5 OZ(175um)
Board Thickness: 1.60±0.15mm

Min. Hole Size: 0.61mm(24mil)
Min. Trace Width: 0.40mm(15mil)

Min. Trace Spacing: 0.40mm(15mil)
Surface Fi... more>>

Packaging & Delivery

Peelable solder mask

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layer count?2L
base material? FR-4
copper thickness? 1/1 OZ (35/35 um)
board thickness? 1.60±0.15mm
min hole diameter? 0.30mm(12mil)
min trace width? 0.16mm(6mil)
min trace spacing? 0.13mm(5mil)
surf... more>>

Packaging & Delivery

OSP Boards

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layer count?2L
base material? FR-4
copper thickness? 1/1 OZ?35/35 um?
board thickness? 1.60±0.15mm
Dimension: 155.52mmX74.46mm/1up
min hole diameter: 0.40mm(16mil)

min trace width: 0.20mm(8mil)
m... more>>

Packaging & Delivery

Double layer boards,Black solder mask

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Quick Details

layers count?2L
base material? FR-4
copper thickness? 1/1 OZ(35/35 um)

board thickness? 1.60±0.15mm
minum hole diameter? 0.61mm(24mil)
min trace width: 0.30mm(11mil)
min trace spacing? 0.16mm(6mil)
... more>>

Packaging & Delivery