Shenzhen Hemeixin Electronics

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Base Material? FR-4+ FPC, Coverlay, standing PP
Layers Count: 6L
Copper Thickness? 1/1/1/1/1/1 OZ ?1OZ=35um)
Board Thickness? 1.60±0.15mm
Min Hole: 0.30mm(12mil)
Min Trace Width: 0.15mm(6mil)
Min Tra... more>>

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layers count?4L
base mateial? ITEQ TG180
board thickness? 1.60±0.15mm
min hole? 0.20mm(8mil)
min trace width? 0.089mm(3.5mil)
min trace spacing? 0.094mm(3.7mil)
surface finishing? ENIG
test? flying p... more>>

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Part Name: 54463-01
Layer count: 6L
Material: FR4 TG150
Thickness: 1.60mm
Part Size: 115.8* 135.2/2 up. ... more>>

Packaging & Delivery