Shenzhen Hemeixin Electronics

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Base Material? FR-4+FPC, coverlay, standing PP
Board Layers:2L
Copper Thickness? 4/4 OZ?1OZ=35um)
Board Thickness? 1.60±0.15mm
Min Hole: 0.30mm(12mil)
Min Trace Width: 13 mil
Min Trace Spacing: 14 mi... more>>

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Materail: Halogen
Board Thickness: 1.2mm
Dimension: 120 mm X 140 mm
Min Trace Width: 6mil (0.15mm)
Min Trace Spacing: 6mil (0.15mm)
Surface Finishing: ENIG
Min Hole: 20mil (0.40mm)
The halogen... more>>

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Layers: 2L
Material: IT180 FR4+ALU
Thickness:0.6 mm
Copper Thickness: 1/1OZ
Board Size:85.19mm*85.19mm
Min line width/spacing:5mil/5mil
Min hole:0.4mm
Surface Finishing: Hard Gold Plating, gold thic... more>>

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Base Material? FR-4+FPC,coverlay, standing PP(tg170)

Copper Thickness? 1/0.5/0.5/1 OZ?1OZ=35um)

Boar Thickness? 1.00±0.10mm
Min Hole: 0.30mm(12mil)
Min Trace Width: 0.15mm(6mil)
Min Trace Spacing: ... more>>

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layer count?20L
base material? FR-4 TG170

copper thickness? all layers 2OZ
board thickness? 3.2mm±0.3mm

min hole diameter? 0.50mm(19mil)
min trace width? 0.20mm(8mil)
min trace spacing? 0.20mm(8mil... more>>

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Part Name: ME-PCB-197-01
Layer count: 8L
Material: FR4
Thickness: 1.60mm
Part Size: 335* 245/1 up. ... more>>

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Part Name: D.1635-61
Layer count: 8L
Material: FR4
Thickness: 1.60mm
Part Size: 137.24* 160/1 up. ... more>>

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Part Name: D.1058-154
Layer count: 8L
Material: FR4
Thickness: 1.60mm
Part Size: 234* 160/1 up. ... more>>

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Number of layers: 4-layer

Copper Thickness: 15/2/2/15 OZ(1OZ=35UM)
Board Thickness: 2.00±0.20mm
Min. Line Width: 0.50mm(20mil)
Min. Line Spacing: 0.50mm(20mil)
Surface Finishing: Lead free HASL
S... more>>

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Layers Count?1L
Base Mateial:Alu
Board Thickness? 1.0±0.15mm
Copper Thickness: 1/0 oz
Min Hole? 0.20mm(8mil)

Min Trace Width? 0.5mm(19mil)

Min Trace Spacing? 0.5mm(19mil)

Surface Finishing? ENIG
T... more>>

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